E-beam evaporation vs sputtering for lift-off metallisation
Why lift-off favours a directional e-beam evaporator, when sputtering still works, and what to check on a used tool before you rely on it for metal patterns.
Pieces, 50 mm (2 in), 75 mm (3 in), 100 mm (4 in) · 1990s–2010s
The FC-2000 is a cryopumped e-beam evaporator built for lift-off metallisation on small batches of wafers. We inspect, refurbish and upgrade used systems for research and pilot lines.
Price on request
Temescal's FC-2000 is a high-vacuum electron-beam evaporator with a cryopumped chamber and dome or planetary fixturing. It is a common lift-off metallisation tool in university cleanrooms and compound semiconductor pilot lines: Ti/Au contacts, Ni/Au, Cr/Au and Pt stacks on III-V wafers or silicon. A used FC-2000 suits a lab that runs several metals per day on pieces and wafers up to about 100 mm.
The long source-to-substrate distance gives directional deposition and low heat load on resist, which is what makes clean lift-off possible. It also means the chamber is tall and the pumpdown matters: a healthy cryopump is central to cycle time. For other film options see our deposition equipment overview.
Systems were configured for their first owner, so the following vary and set the value of a used tool:
Our post on e-beam evaporation vs sputtering for lift-off explains when the extra directionality of evaporation is worth having.
We regenerate the cryopump, pump the chamber down and record base pressure and the time to reach process pressure. The gun is run on each pocket with a known material, and we check emission stability, sweep pattern and arcing at full voltage. The crystal monitor, shutters, fixture rotation and venting are checked, along with interlocks on the door and high voltage.
Typical wear points are e-beam filaments and insulators, crucible indexer mechanics, worn rotation drives on planetary fixtures, crystal head connectors and tired cryopump displacers. Flaking on shields and the chamber walls is expected and handled in cleaning.
Refurbishment strips and cleans the chamber and fixtures, replaces seals and gun consumables, overhauls the cryopump and compressor and recalibrates gauges and the thickness controller. Certified tools are run on a test deposition with thickness uniformity in the report. Our vacuum system refurbishment service covers the pumping side in detail.
On older systems, the most useful upgrade is often new sequencing control: a control system retrofit replaces failing relay logic or obsolete computers and adds recipe and logging. A newer gun supply is the other frequent request.
Count the metals in your stacks and compare that with the pockets and liners available. Check that the fixture fits your wafer size, or budget for a new one. Ask whether the cryopump has a service record, as it is the most expensive single item to replace after the gun supply.
Typical values for the platform. Each tool’s inspection report lists its actual configuration.
Rebuild used tools to their original specification, with a written scope and a test report.
Learn moreRetrofit older tools with new controls, light sources, pumps, wafer sizes or endpoint detection.
Learn moreKeep older process tools running with planned maintenance, repair, calibration and parts.
Learn moreMoving a process tool from one cleanroom to another, and getting it running at the new site.
Learn moreNeed a spare part for the FC-2000? Send us the part number and we will check what we can supply.
A long throw distance and dome or planetary fixturing give a directional flux with little sidewall coverage, which is what clean lift-off needs. Several wafers can be coated in one run with good uniformity.
Common lift-off metals such as Ti, Cr, Ni, Au, Al, Pt and Pd are typical, depending on crucible liners and power. Refractory metals need more power and careful process work, so we discuss them before you buy.
Some chambers have ports for an ion source for pre-clean or assisted deposition. Whether it fits depends on the chamber and fixture, which we check during inspection.
Filament condition, beam sweep, crucible indexing and the high-voltage cable and feedthrough. Worn insulators and arcing at high voltage are the usual faults on older guns.
200 mm (8 in) · 1990s–2000s
150 mm (6 in) · 2000s–2020s
Why lift-off favours a directional e-beam evaporator, when sputtering still works, and what to check on a used tool before you rely on it for metal patterns.
Old controllers, discontinued boards and lost manuals retire most legacy tools. How to plan spares, backups and retrofits before a failure forces it.
Why a second-hand etcher or furnace can need an export licence, which rules usually apply in the EU, and what buyers and sellers should prepare before shipping.
Tell us the process, wafer size and facilities. We reply with availability, an inspection report and a refurbishment scope.