PSC-101 spin rinse dryer
200 mm (8 in) · 1990s–2000s
Spin rinse dryers, single-wafer spray processors, CMP systems and lapping machines, refurbished and serviced for cleaning, stripping and planarisation.
Batch rinse and dry of wafer cassettes after wet benches; small, reliable and found in almost every fab.
Spin-spray tools for resist develop, strip, clean and metal etch with controlled chemistry per wafer.
Chemical mechanical planarisation of oxides and metals, from research polishers to 200 mm production platforms.
Thinning and polishing of wafers and materials samples, including compound semiconductors and optics.
200 mm (8 in) · 1990s–2000s
Square substrates on some models · 1990s–2010s
200 mm (8 in) · Late 1990s–2000s
150 mm (6 in) · 1990s–2000s
100 mm (4 in) · 1990s–2010s
Wet steps sit between almost every other step in a process flow: clean before furnaces, develop and strip around lithography, rinse and dry after etching. Planarisation by CMP adds a mechanical step where a film needs to be flat for the next layer. The tools are less glamorous than etchers or steppers, but a wafer that leaves a wet step with particles or residue ruins whatever comes next.
We sell used and refurbished wet processing and CMP equipment, and we service installed tools, from rotors and seals to dispense systems and controllers.
Spin rinse dryers such as the Semitool PSC-101 rinse a cassette of wafers in deionised water and spin them dry in nitrogen. They follow wet benches and are among the most reliable tools in a fab, provided the rotor, bearings and resistivity monitoring are kept in order.
Single-wafer spray processors like the SSEC 3300 series process one wafer at a time with chemistry dispensed onto a spinning wafer. They suit resist strip, develop, lift-off and post-CMP clean, especially where the chemistry or the substrate changes often.
CMP systems remove topography with a slurry, a pad and controlled pressure. The Applied Materials Mirra is a 200 mm production platform with several polishing heads; the Strasbaugh 6EC is a smaller tool frequently found in research and development. Both need good slurry handling and pad conditioning to give stable removal rates. Plan time after installation to qualify pads, slurries and conditioner discs, because removal rate and within-wafer uniformity depend as much on these consumables as on the tool.
Lapping and polishing systems such as the Logitech PM5 thin and polish wafers and samples. They are standard in compound semiconductor, optics and materials labs, where substrates are small, brittle or unusual.
Wet tools wear at their seals and bearings, and corrode where chemistry finds a way out. Refurbishment usually means rebuilding the rotor or spindle, renewing seals, valves and tubing, and testing the fluid path under pressure. On CMP tools the heads, membranes and platen drives get most of the attention, followed by slurry delivery.
When a tool keeps stopping on interlocks that nobody can trace, repair and troubleshooting gets to the root cause before parts are swapped. Older controllers can be replaced with modern recipe control where spares have run out.
Send us your process flow and chemistry, and we will match the tools and the hook-up to your facility.
Usually, by changing the rotor and cassette. We confirm the rotor and cassette type your tool needs before ordering parts.
It can be if you need repeatable 200 mm planarisation. For small-volume work on pieces and smaller wafers, a research polisher is usually easier to run and cheaper to keep.
Wetted parts are flushed and cleaned before shipping, and we note the chemicals the tool has seen in the report so your EHS team can review them.
Typically deionised water, slurry supply, drains for slurry waste, compressed air, exhaust and electrical power, plus space for the slurry delivery system.
Often yes. Wetted materials are chosen for the chemistry, and we check compatibility before refurbishing the fluid path.
Tell us the process, wafer size and facilities. We shortlist tools that fit and send an inspection report with every offer.