We convert used and installed tools between 100, 150 and 200 mm wafers, or fit carriers for pieces and smaller wafers, so the tool matches the rest of your line.
Wafer size decides which tools can share a line. A university that moves its teaching programme from 100 mm to 150 mm, or a pilot line that standardises on 200 mm to match a foundry partner, needs every tool to handle the new size. Buying a used tool that was configured for a different size is common, because the right platform rarely comes in the right configuration.
Wafer size conversion changes the parts that touch the wafer so the tool runs the new size. On many single-wafer and batch platforms the chamber was designed for a range of sizes and only the wafer-handling parts differ. For a broader view of the trade-off, see 150 mm vs 200 mm tools for pilot lines.
What changes depends on the tool, but a conversion usually involves some of these:
Wafer thickness changes with size, too: 150 mm and 200 mm wafers are thicker than 100 mm wafers, which matters for clamp height, sensors and robot pick-up.
For research tools that see mixed wafer sizes and pieces, a carrier wafer or carrier plate can be the better answer. The tool stays at its larger size and small wafers or pieces sit on a carrier. Carriers change heat transfer and sometimes need bonding or thermal paste, so etch rate and temperature on the small sample need checking. We can supply carriers matched to the tool and run a test to show the effect.
For older platforms the deciding question in the feasibility check is often whether the conversion parts can still be found, new or refurbished. If they cannot, the check says so before you commit to anything, and carriers may be the fallback.
Handling is proved before process. Test wafers are cycled through every transfer position to check centring and clamping, because a wafer broken in a load lock or chamber costs far more time to clear than a handling test takes. Only then does the process test on the new size run.
Downtime depends mostly on parts availability and on how many handling stations need teaching. Simple single-wafer tools with a drop-in electrode or chuck are quick to convert. Cluster tools with several chambers, a central robot and load locks take longer, because each transfer position is taught and tested. Parts are sourced before the tool goes down, and the proposal states the planned downtime.
You receive the feasibility findings, the installed parts list, the handling test record, process test results and updated configuration notes. Conversions apply to single-wafer etch systems such as the Oxford Plasmalab System 100, on mask aligners and on wet processing tools.
Our engineers check whether the platform supports the target size and which parts change.
We source chucks, clamps, cassettes and handling parts for the new size, new or refurbished.
We fit the parts, adjust lift pins and sensors, and teach the robot and aligner the new positions.
We run handling cycles and a process test on the new wafer size and record the results.
200 mm (8 in) · Late 1990s–2010s
No. The chamber, electrode, stage and transfer path must be large enough for the target size, and some platforms were only built for one size. The feasibility check answers this before any cost is committed.
Often, for research use with mixed sizes and pieces. Carriers trade some temperature control and throughput for flexibility, so for a single production size a proper conversion is usually better.
Yes. Most 200 mm wafers use a notch, while 150 mm and smaller usually use flats, so pre-aligners, sensors and cassettes have to match the new wafer.
It can, because electrode area, clamping and gas flow per wafer change with size. We run a process test on the new size and help you adjust recipes.
Substrates, tool availability, automation and facilities all change between 150 and 200 mm. How to pick a wafer size for a pilot line built on used tools.
Tell us the tool and what you need. We scope the work and send a written offer.