PECVD vs LPCVD silicon nitride: which film for which job
Temperature, stress, hydrogen content and etch resistance separate PECVD and LPCVD nitride. How to choose the process, and the tool, for your device.
100 mm (4 in), 150 mm (6 in), 200 mm (8 in) · 1990s–2020s
Tempress TS series stacks run oxidation, diffusion, anneal and LPCVD tubes in one frame. We inspect, refurbish and reconfigure used furnaces tube by tube for research and pilot lines.
Price on request
Tempress Systems is a Dutch furnace builder whose horizontal TS series is found in university cleanrooms, MEMS foundries and solar and power device lines across Europe. A stack holds several tubes, each configured for one process: wet or dry oxidation, boron or phosphorus diffusion, anneal, or LPCVD of polysilicon, nitride and oxide. A used Tempress diffusion furnace suits labs that need thermal oxide and LPCVD films of a quality that plasma tools cannot match.
Because each tube is an independent process module, the right used furnace is the one whose tubes match your process list. We describe every tube separately when we offer a stack. A typical four-tube research stack might hold:
Many stacks deviate from this, so treat it as a starting point rather than a standard. For the rest of the thermal range, see thermal processing equipment.
For each tube we check:
Typical wear points are heating elements, thermocouples, quartz tubes on LPCVD positions, door and flange seals and drifting mass flow controllers.
We replace or reseat elements where needed, fit new thermocouples, clean or replace quartzware and leak test every gas line. LPCVD tubes receive pump service and pressure control calibration; see calibration for how we document temperature and flow checks. Certified tubes are run with test wafers and the oxide or film thickness and uniformity are in the report.
Common upgrades are a controller or host software update, new boats and quartzware for a wafer size conversion and dry pumps on LPCVD tubes. If you are choosing between LPCVD and plasma nitride, our post on PECVD vs LPCVD silicon nitride compares the two.
Map each tube to a process before buying, and plan for dedicated tubes where contamination matters. Check element and quartz condition, as both are significant costs. Make sure your building can deliver the power and exhaust: furnaces draw more current than most other tools in a small cleanroom.
Typical values for the platform. Each tool’s inspection report lists its actual configuration.
Rebuild used tools to their original specification, with a written scope and a test report.
Learn moreRetrofit older tools with new controls, light sources, pumps, wafer sizes or endpoint detection.
Learn moreKeep older process tools running with planned maintenance, repair, calibration and parts.
Learn moreMoving a process tool from one cleanroom to another, and getting it running at the new site.
Learn moreNeed a spare part for the TS series? Send us the part number and we will check what we can supply.
Yes. Each tube has its own gas system, heating zones and, on LPCVD tubes, its own pumping, so oxidation, diffusion and deposition can share one stack. Keeping dopant and gate oxide tubes separate is standard practice for contamination control.
Usually, by fitting quartz tubes, boats and paddles for the new size and re-profiling the zones. We check element and tube diameter limits before we quote.
It depends on temperature, cycling and how the tube was run. We measure element resistance and check the flat zone during inspection, and list elements near end of life in the report.
Gas and exhaust hook-up for LPCVD and doping tubes, including toxic gas detection and abatement, usually sets the schedule. The frame itself is straightforward to rig.
200 mm (8 in) · 1990s–2020s
150 mm (6 in) · 1980s–2000s
Temperature, stress, hydrogen content and etch resistance separate PECVD and LPCVD nitride. How to choose the process, and the tool, for your device.
When a dry pump conversion pays off on an etcher, CVD tool or evaporator, how to size the replacement and what changes in facilities and interlocks.
Substrates, tool availability, automation and facilities all change between 150 and 200 mm. How to pick a wafer size for a pilot line built on used tools.
Tell us the process, wafer size and facilities. We reply with availability, an inspection report and a refurbishment scope.