Finetech FINEPLACER lambda die and flip-chip bonder

Where the FINEPLACER lambda fits

The Finetech FINEPLACER lambda is a sub-micron die bonder and flip-chip bonder for research and prototype assembly. It aligns a die over a substrate by overlaying the images of both through a vision alignment system, then places and bonds it with controlled force and heat. Photonics groups use it to place laser diodes, VCSELs and photodiodes; MEMS and sensor labs use it for flip-chip trials and multi-chip assemblies.

A used FINEPLACER lambda gives a research lab precise placement without the cost of a production die bonder. Its value lies in the modules fitted. Thermocompression, thermosonic, adhesive and solder bonding all need specific heaters, tools and in some cases process gas modules, so a used unit is only as useful as its accessory set. For wire bonding after die attach, see the TPT HB16.

What we inspect on a used lambda

• Vision alignment system. Image quality, illumination, overlay calibration and the beam splitter optics.
• Placement accuracy. We place test dies on a reference substrate and measure the offset. The results go in the inspection report.
• Bond head and force. Force calibration across the range, parallelism of the bond tool to the substrate, and the motion of the placement arm.
• Heating. Substrate heater and bond head heating ramp, accuracy and stability, and the cooling function.
• Process modules. Each fitted module is powered and checked: ultrasonic, dispensing, curing or gas.
• Tools and accessories. Bond tools, vacuum pick-up tools, substrate holders and their condition.
• Software and PC. Software version, stored processes and PC condition.

Refurbishment scope

Typical work includes cleaning and recalibrating the vision system, adjusting tool parallelism, calibrating force and temperature, replacing worn pick-up tools and vacuum lines, and checking each process module. We then place test parts and measure the result. The unit is graded Certified, Refurbished, Inspected or As-is. Because accuracy depends on tooling and set-up, a Certified grade includes placement results on parts similar to yours where you supply them, through test and certification.

Upgrades and spare parts

Most labs add modules as their projects change: an ultrasonic module for gold-to-gold bonding, adhesive dispensing and UV curing for optical assemblies, or a gas module for fluxless soldering with gold-tin or indium. Bond tools and substrate heaters for new die sizes are the most frequent purchases. Some modules differ between the original lambda and the lambda 2, so we check compatibility before quoting. Tools, heaters and vacuum parts are available through spare parts.

Facilities

• Single-phase mains power
• Vacuum for pick-up tools and substrate holders
• Clean dry air, depending on configuration
• Nitrogen or forming gas for the process gas modules, where fitted
• Exhaust for process gas or adhesive fumes, depending on process
• A stable, vibration-free bench in a clean, temperature-stable room

Buying advice

Write down your die sizes, substrate types and the bonding process before comparing used units. Then check the module and tool list against it; missing modules are often what drives the cost of a used flip-chip bonder. Ask for the software version and whether stored processes are included. Room stability matters for sub-micron work, and a session of operator training on alignment and force set-up shortens the learning curve. If your parts need wire bonds rather than flip-chip joints, compare the bonders in our packaging equipment overview.