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Oxford Instruments

Oxford Instruments Plasmalab 80 Plus RIE system

Pieces, 50 mm (2 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in) · 1990s–2010s

The Plasmalab 80 Plus is a compact open-load RIE that many teaching labs use for dielectrics, polymers and descum. We supply used and refurbished units and service yours.

Price on request

Where the Plasmalab 80 Plus fits

The Oxford Instruments Plasmalab 80 Plus is a parallel-plate reactive ion etcher with an open-load chamber: you lift the lid, place wafers or pieces on the 240 mm electrode and pump down. There is no load lock and no wafer handling, which keeps the tool compact and easy to maintain. Labs buy a used Plasmalab 80 Plus for etching silicon oxide and nitride, patterning polymers, removing resist residue and running short silicon etches, often as the first plasma tool in a new cleanroom.

The 80 Plus was also sold as a PECVD system, and the platform was later succeeded by the PlasmaPro 80. When you look at listings, check that you are buying the etch version. Where you need deep or vertical silicon features, a Plasmalab System 100 ICP or a DRIE tool is the better fit.

Common wear points

An open-load RIE sees air at every run and many hands on the lid, so wear concentrates in a few places:

  • Lid seal and hinge: worn O-rings and misaligned lids cause slow pump-down and poor leak rates.
  • Electrode surface: pitting, residue and damaged cover plates that change etch uniformity.
  • Upper electrode or showerhead: blocked gas holes and deposits.
  • RF match: tuning range and capacitor wear; arcing marks on the electrode feed.
  • Pumps: oil condition and contamination in oil-sealed backing pumps, turbo hours.
  • Gas lines: mass flow controller calibration and leaks at fittings.

We record base pressure, leak-up rate and, where the tool runs, a reference etch rate.

Refurbishment and service

Refurbishment strips and cleans the chamber, replaces seals, cover plates and worn consumables, services the turbo and checks the RF generator and match. Mass flow controllers are calibrated or replaced. If you have one already, a preventive maintenance plan covers lid seals, electrode cleaning and pump service on a schedule that suits a busy teaching tool.

Upgrades

Oil-sealed backing pumps on older units are worth replacing with dry pumps, especially if the tool runs oxygen-rich or corrosive processes; our dry pump conversion covers the work. Endpoint detection by laser interferometry or optical emission helps when you etch through a thin film onto something you must not damage. Extra gas lines and a refreshed control PC complete most upgrade lists.

Facilities

  • Single or three-phase power, depending on configuration
  • Cooling water for the RF generator, turbo pump and electrode
  • Nitrogen for venting and purge
  • Clean dry air for pneumatic valves
  • Process gas supply for the gases fitted
  • Exhaust from the pump, with abatement where needed

Buying advice

Check the generator power and the gas lines fitted, because they define which processes you can run. Ask for the pump type and hours, and whether the chamber has been used with metals or chlorine. If many users will share the tool, agree how pieces are mounted: oil or paste used to fix pieces to carrier wafers leaves residue on the electrode, and a lab rule on mounting keeps etch rates repeatable. Our post on ICP versus RIE helps if you are unsure which class of etcher you need, and the etch category lists the alternatives.

Specifications

Typical configuration

Wafer sizes
Pieces, 50 mm (2 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)
Configuration
Parallel-plate reactive ion etcher, open load (no load lock)
Lower electrode
240 mm diameter, RF-powered
RF generator
13.56 MHz, typically 300 W or 600 W depending on configuration
Substrates
One 200 mm wafer or several small wafers and pieces, depending on configuration
Pumping
Turbomolecular pump with backing pump
Process gases
Typically fluorine-based gases with O2 and Ar; gas lines depending on configuration

Typical values for the platform. Each tool’s inspection report lists its actual configuration.

Services

What we do for the Plasmalab 80 Plus

Refurbishment

Rebuild used tools to their original specification, with a written scope and a test report.

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Upgrades

Retrofit older tools with new controls, light sources, pumps, wafer sizes or endpoint detection.

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Maintenance

Keep older process tools running with planned maintenance, repair, calibration and parts.

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Installation

Moving a process tool from one cleanroom to another, and getting it running at the new site.

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Upgrades

Common upgrades

About upgrades
  • Dry backing pump in place of an oil-sealed pump
  • Laser or optical endpoint detection
  • Extra gas lines and mass flow controllers
  • Control PC refresh

Need a spare part for the Plasmalab 80 Plus? Send us the part number and we will check what we can supply.

FAQ

Questions and answers

Is an RIE enough, or do I need an ICP etcher?

For thin dielectrics, polymers, descum and shallow silicon features, an RIE like the 80 Plus is usually enough and cheaper to run. For deep or high-rate anisotropic etching, you need an ICP.

Can the 80 Plus be used for PECVD?

The same frame was also sold as a PECVD system with a heated electrode and showerhead. An etch unit is not simply switched to deposition; we tell you which version a used tool is.

What does open load mean in daily use?

You vent the chamber and place samples on the electrode by hand. It is quick for small batches, but each run exposes the chamber to room air, so pump-down time and chamber cleanliness matter.

Etch

More tools in this category

All etch
Guides

Related reading

All guides
Next step

Interested in the Oxford Instruments Plasmalab 80 Plus?

Tell us the process, wafer size and facilities. We reply with availability, an inspection report and a refurbishment scope.