Keeping legacy semiconductor tools running when parts go obsolete
Old controllers, discontinued boards and lost manuals retire most legacy tools. How to plan spares, backups and retrofits before a failure forces it.
Refurbished sputter systems, e-beam evaporators, ALD and PECVD tools and 200 mm cluster platforms, rebuilt and serviced for research labs and pilot lines.
Magnetron PVD of metals, nitrides and oxides, from single-chamber research tools to 200 mm cluster platforms.
Directional evaporation of metals for lift-off, often with several crucibles and a planetary fixture.
Low-temperature silicon oxide, nitride and amorphous silicon films for passivation, masks and optics.
Conformal oxide films such as Al2O3 and HfO2, one atomic layer at a time, popular in materials and device research.
Multi-chamber 150 and 200 mm production tools for dielectric, tungsten and metal stacks.
200 mm (8 in) · 1990s–2000s
200 mm (8 in) · 1990s–2000s
150 mm (6 in) · 2000s–2020s
100 mm (4 in) · 1990s–2010s
200 mm (8 in) · 2000s–2020s
150 mm (6 in) · 1990s–2000s
Deposition covers more different machines than any other category on this site. A teaching lab may only need a sputter coater and an evaporator; a pilot line may run a multi-chamber cluster tool that deposits a complete barrier and metal stack without breaking vacuum. What they have in common is vacuum, and most of the condition questions for used deposition equipment are vacuum questions.
We sell refurbished PVD, CVD and ALD tools and service the ones you already run, from pumps and gauges to sources, heaters and controllers.
Single-chamber PVD tools such as the Kurt J. Lesker PVD 75 are configured to order with sputter guns, thermal or e-beam sources, or a mix. They are the flexible choice for research groups that change materials often.
E-beam evaporators like the Temescal FC-2000 load several crucibles and a fixture of wafers in one run. They are the standard for metal lift-off. The trade-offs against sputtering are set out in our article on e-beam evaporation versus sputtering for lift-off.
PECVD systems such as the STS 310PC deposit silicon oxide and nitride at temperatures well below LPCVD, which suits processed wafers and polymer layers.
Thermal ALD tools like the Veeco (Cambridge NanoTech) Savannah grow conformal films in cycles. They are compact and widely used in research, but precursor handling governs where you can put one. Thermal ALD is strongest for oxides such as Al2O3 and HfO2; nitrides and most metals generally need a plasma tool or specific chemistries, so check your target films against the precursor lines fitted.
Cluster platforms such as the Applied Materials Endura 5500 and Centura 5200 group several process chambers around a central wafer handler. They are built for 150 and 200 mm production. They bring automation and repeatability, along with a large footprint and a long facilities list.
A deposition tool can look clean and still fail on vacuum. Our inspection report covers:
Shields, fixtures and chamber liners take the build-up in a deposition tool, so they are cleaned or replaced as a matter of routine. Where the vacuum system is the weak point, vacuum system refurbishment covers pumps, valves, gauges and seals, with a leak test before and after.
Typical upgrades include new magnetron or e-beam power supplies, extra sputter sources, load locks on open-load systems and PC-based control to replace obsolete hardware. On cluster tools, conversion work and controller support are the deciding factors for how long the platform can stay in service.
Tell us your films, thicknesses and substrates, and we will propose the deposition tools that fit your lab and budget.
E-beam evaporation is usually preferred for lift-off because the flux is directional and sidewall coverage is low. Sputtering gives better step coverage and adhesion, which works against clean lift-off.
Yes, if it has RF as well as DC power and suitable targets. Reactive sputtering of oxides and nitrides also needs the right gas lines and process control.
They make sense when you need repeatable 200 mm metal stacks at volume. For research with frequent material changes, a single-chamber tool is usually cheaper to run and easier to reconfigure.
Precursors such as trimethylaluminium are pyrophoric and need proper storage, delivery and exhaust. We review your precursor list and site rules before installation.
We can advise on consumables for each platform and source spare parts. Targets and source materials are usually bought from material suppliers to your specification.
Old controllers, discontinued boards and lost manuals retire most legacy tools. How to plan spares, backups and retrofits before a failure forces it.
Why a second-hand etcher or furnace can need an export licence, which rules usually apply in the EU, and what buyers and sellers should prepare before shipping.
Thermal ALD gives the best conformality and the simplest tool. Plasma ALD adds lower temperatures and more materials. How to choose for a shared research lab.
Tell us the process, wafer size and facilities. We shortlist tools that fit and send an inspection report with every offer.