PECVD vs LPCVD silicon nitride: which film for which job
Temperature, stress, hydrogen content and etch resistance separate PECVD and LPCVD nitride. How to choose the process, and the tool, for your device.
Pieces, 100 mm (4 in), 150 mm (6 in) · 1990s–2000s
The STS 310PC is a parallel-plate PECVD reactor for silicon oxide, nitride and amorphous silicon. We inspect, refurbish and update the controls on used systems for research and MEMS work.
Price on request
The 310PC was built by Surface Technology Systems in the UK, a supplier whose plasma tools spread widely through university and MEMS cleanrooms. It is a single-chamber, parallel-plate PECVD reactor that deposits silicon dioxide, silicon nitride, oxynitride and amorphous silicon at temperatures far below a furnace. A used 310PC suits a lab that needs passivation, hard masks, sacrificial layers or optical films on pieces and wafers up to about 150 mm.
Its strength is the mixed-frequency RF arrangement: a 13.56 MHz supply combined with a low-frequency generator lets you set film stress, which matters for membranes, cantilevers and thick layers. Exact frequencies vary between systems, so we list them for each tool. See our deposition equipment page for alternative deposition routes.
PECVD nitride is hydrogen-rich and less dense than LPCVD nitride but grows at a fraction of the temperature and on substrates that already carry metal. Our post on PECVD vs LPCVD silicon nitride compares film properties and tool choice for typical research processes.
We pump the chamber down and log base pressure and leak rate, then check the heated electrode against its setpoint with an independent probe. Both RF generators are run into a dummy load and then on plasma, with reflected power and match tuning recorded. Every mass flow controller is checked for zero and flow, the gas pod is leak tested and the interlocks for toxic gas and exhaust are traced.
Common wear points on this platform are:
Refurbishment covers chamber and showerhead cleaning or replacement, new seals, heater and thermocouple checks, gas line leak testing and pump service. For Certified systems we deposit oxide and nitride test films and report thickness, refractive index and uniformity.
The most frequent upgrade is a control system retrofit: the original computer and software are replaced with current hardware and recipe control, while the process hardware stays the same. Other upgrades include new RF generators, new mass flow controllers and a dry pump conversion, which suits silane chemistry better than an oil-sealed pump.
Check which gases the tool has run and which lines are fitted before planning your recipes. Confirm the RF configuration if stress control matters to you. Budget for gas safety hook-up; on most sites it costs more time than moving and installing the tool.
Typical values for the platform. Each tool’s inspection report lists its actual configuration.
Rebuild used tools to their original specification, with a written scope and a test report.
Learn moreRetrofit older tools with new controls, light sources, pumps, wafer sizes or endpoint detection.
Learn moreKeep older process tools running with planned maintenance, repair, calibration and parts.
Learn moreMoving a process tool from one cleanroom to another, and getting it running at the new site.
Learn moreNeed a spare part for the 310PC? Send us the part number and we will check what we can supply.
Alternating or mixing the high- and low-frequency RF lets you tune film stress from tensile to compressive. For MEMS membranes and thick passivation layers that is often the main reason to choose this tool.
Many 310PC systems still run on their original PC-based software, which works but is hard to support. We check the computer and interface during inspection and can quote a retrofit if spare hardware is a concern.
Some STS PECVD systems were configured for liquid TEOS delivery as well as silane. Whether a particular tool can depends on the hardware fitted, which we document.
Silane and ammonia supply with gas detection, and an exhaust or abatement route that suits them, are usually the long-lead items. The tool itself is compact.
200 mm (8 in) · 1990s–2000s
150 mm (6 in) · 2000s–2020s
Temperature, stress, hydrogen content and etch resistance separate PECVD and LPCVD nitride. How to choose the process, and the tool, for your device.
Old controllers, discontinued boards and lost manuals retire most legacy tools. How to plan spares, backups and retrofits before a failure forces it.
Why a second-hand etcher or furnace can need an export licence, which rules usually apply in the EU, and what buyers and sellers should prepare before shipping.
Tell us the process, wafer size and facilities. We reply with availability, an inspection report and a refurbishment scope.